01
Six-axis robot that moves FOUPs, process kits, and chamber parts inside the cleanroom.
Graded silicon carbide grit for double-side wafer lapping and edge grinding.
Automated optical inspection that finds scratches, particles, and edge chips after each process step.
Oil-free screw pump for load locks and etch chambers.
Ceramic chuck that holds the wafer flat during etch and deposition.
02
| Model | Type | Wafer size | Key rating | Footprint |
|---|---|---|---|---|
| CW-R60 | Handling robot | 200 · 300 mm | Payload 60 kg | 1.2 × 1.0 m |
| CW-I3 | Macro inspection | 200 · 300 mm | 120 wafers/h | 1.6 × 1.4 m |
| CW-DP400 | Dry screw pump | — | 400 m³/h | 0.9 × 0.5 m |
| CW-EC300 | Electrostatic chuck | 300 mm | Helium cooling | Ø 300 mm |
03
A 200 mm power-device line added two CW-I3 systems after polishing and cut wafers scrapped at final test by 18% in six months.
A packaging plant moves FOUPs between stockers and grinders with CW-R60 robots on three shifts, with no wafers carried by hand.
04
Yes. Send the bay drawing and utility points, and we propose a layout with service clearances before you order.
Common spares ship from stock within 24 hours, and every tool comes with a recommended spare-parts list.
Each tool runs a factory acceptance test on your wafers or ours, and the report ships with the tool.