Corlith Wafer Systems

Wafer handling and inspection tools for 200 and 300 mm fabs

Handling robots, inspection systems, dry pumps, and chucks. Every tool ships with a factory acceptance report and a spare-parts list.

1,450

tools installed since 2004

countries with running tools

98.5%

average tool uptime

72h

field engineer on-site target

Tool lineup

Six-axis robot that moves FOUPs, process kits, and chamber parts inside the cleanroom.

Graded silicon carbide grit for double-side wafer lapping and edge grinding.

Automated optical inspection that finds scratches, particles, and edge chips after each process step.

Oil-free screw pump for load locks and etch chambers.

Ceramic chuck that holds the wafer flat during etch and deposition.

Model	Type	Wafer size	Key rating	Footprint
CW-R60	Handling robot	200 · 300 mm	Payload 60 kg	1.2 × 1.0 m
CW-I3	Macro inspection	200 · 300 mm	120 wafers/h	1.6 × 1.4 m
CW-DP400	Dry screw pump	—	400 m³/h	0.9 × 0.5 m
CW-EC300	Electrostatic chuck	300 mm	Helium cooling	Ø 300 mm

A 200 mm power-device line added two CW-I3 systems after polishing and cut wafers scrapped at final test by 18% in six months.

A packaging plant moves FOUPs between stockers and grinders with CW-R60 robots on three shifts, with no wafers carried by hand.

Can you fit a tool into our existing bay?

Yes. Send the bay drawing and utility points, and we propose a layout with service clearances before you order.

How fast do spare parts arrive?

Common spares ship from stock within 24 hours, and every tool comes with a recommended spare-parts list.

Do you test tools before shipping?

Each tool runs a factory acceptance test on your wafers or ours, and the report ships with the tool.